3-D Integration Platforms for Future Heterogeneous MEMS
- Reference number
- ID14-0033
- Start and end dates
- 150101-211231
- Amount granted
- 2 233 825 SEK
- Administrative organization
- KTH - Royal Institute of Technology
- Research area
- Materials Science and Technology
Summary
During the past 5 years, MEMS technology has been the driver of innovation within a number of vibrant ICT fields and had a large impact on industry and society. For example, modern smart phones rely on MEMS accelerometers and gyroscopes for engaging and interacting with the user in novel ways. The International Technology Roadmap for Semiconductors emphasizes that “… the greatest challenges for the MEMS technologies are related to their integration aspects, and are primarily linked to the back-end of manufacturing, packaging …”. In this Industrial PhD Student Project we propose to explore critical aspects for emerging 3-D integration platforms for next generation heterogeneous MEMS systems. The MEMS 3-D integration technologies that will be researched in this project are: (1) "Temporary wafer bonding using polymer adhesives for TSV processing and thin wafer handling. (2) "High-density metal Trough-Silicon-Vias (TSV) for high frequency applications. (3) "Re-configured polymer substrates with TSVs for heterogeneous 3-D MEMS integration, including Lab-on-Chip (LoC) and Radio Frequency (RF) devices. The Department of Micro- and Nanosystems at KTH Royal Institute of Technology (KTH-MST) and Silex Microsystems AB (Silex) in Järfälla are two world-leading Swedish actors in MEMS that are teaming up to address key challenges in 3-D MEMS integration and packaging.
Popular science description
N/A