System on Chip solutions for future high speed communication
- Reference number
- RE07-0076
- Start and end dates
- 080701-140630
- Amount granted
- 24 000 000 SEK
- Administrative organization
- Chalmers University of Technology
- Research area
- Information, Communication and Systems Technology
Summary
The proposed program is aiming at hardware solutions for future wireless high datarate microwave links by using the most advanced foundry processes available today, for future applications in a frequency range 70-300 GHz. The technology is generic and other interesting applications such as sensors for passive millimeterwave imaging, millimeterwave/THz radar etc can be realized. The purpose is to develop highly integrated semiconductor MMICs for next generations of short range /medium range wireless data links with bitrates from 2 Gbit/s to >10 Gbit/s . The main focus will be 120 and 220 GHz fully integrated frontends for such wireless links. Due to the enormous available bandwidth (tens of GHz), extremely high data rate can potentially be realized. The MMICs will be integrated in modules for point-point link system measurement. Our goal is to be the first group in the world demonstrating 2 fully integrated wireless 10 Gbit/s Ethernet chipset working in two bands, 120 and 220 GHz, including integration of the antenna, and to integrate the chip in a carrier module. The MMIC-solution will include baseband circuits and module design for a fully functional demonstrator. 2 multinational companies are our partners, ensuring the quality of the program. The workplan include -Project management -System simulation and design -Modeling of active and passive devices, designkit development -Circuit demonstrators -Multifunction MMIC development -Module design -System measurements